Chemical-mechanical polishing
id:
chemical-mechanical-polishing-284-14942461
title:
Chemical-mechanical polishing
text:
Chemical mechanical polishing (CMP) is a process of smoothing surfaces with the combination of chemical and mechanical forces. It can be thought of as a hybrid of chemical etching and free abrasive polishing. It is used in the semiconductor industry to polish semiconductor wafers as part of the integrated circuit manufacturing process.
brand slug:
wiki
category slug:
encyclopedia
description:
Polishing technique used during semiconductor fabrication
original url:
https://en.wikipedia.org/wiki/Chemical-mechanical_polishing
date created:
date modified:
2024-01-30T18:12:59Z
main entity:
{"identifier":"Q1069404","url":"https://www.wikidata.org/entity/Q1069404"}
image:
fields total:
13
integrity:
14