Fan-out wafer-level packaging
id:
fan-out-wafer-level-packaging-260-14896810
title:
Fan-out wafer-level packaging
text:
Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages. In conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size. By contrast, in standard WLP flows integ
brand slug:
wiki
category slug:
encyclopedia
description:
original url:
https://en.wikipedia.org/wiki/Fan-out_wafer-level_packaging
date created:
date modified:
2024-03-29T21:31:25Z
main entity:
{"identifier":"Q60745230","url":"https://www.wikidata.org/entity/Q60745230"}
image:
{"content_url":"https://upload.wikimedia.org/wikipedia/commons/7/78/EWLB_Sketch_e.png","width":429,"height":285}
fields total:
13
integrity:
14